• 5 Lines – 3 New In 2015
• Up to 48” Board Capability
• Flex, Rigid & Aluminum Clad
• Fine Pitch BGAs
• Package Sizes (74mm x 74mm to 01005)
• Part on Part Placement (POP chips)
• Automated Optical Inspection
• Solder Paste Inspection
• X-Ray
• Slide Lines
• Leaded Wave Reflow
• ROHS Wave Reflow
• Task-Metered Conveyor Assembly Lines
• Press Fit Connectors
• Solder Robot
• Partial (sub-level) Product Assembly
• Full Product Assembly
• Final Product Testing/Burn-In Tests
• Packaging & Labeling
• Full Drop-Ship Integration
• New Product Introduction (NPI): We thoroughly assess each project upfront. This clarifies assembly requirements and often reveals hidden project challenges
• On-the-fly permanent and temporary change requests
• Order pull-ins: We can adjust shipping to within 7-10 business days; assuming material availability